Artificial Intelligence | Samsung Commences Mass Production of Next-Gen HBM4 AI Chips

Samsung Electronics Co. commenced mass production of its next-generation HBM4 memory chips on February 12, 2026, vital for powering expanding artificial intelligence (AI) data centres.

What Happened / Key Details

Samsung announced it has begun mass production and commercial shipments of its HBM4 chips, describing the advancement as "industry-leading." These chips are engineered for high-performance computing environments, including artificial intelligence (AI), machine learning, and graphics-intensive applications.

HBM4 represents the sixth generation of High-Bandwidth Memory, building upon its predecessors by enhancing memory density, bandwidth, and overall efficiency. According to Samsung, its HBM4 chips operate at 11.7 Gigabits-per-second (Gbps), which surpasses the industry standard of 8Gbps by approximately 46%, and deliver a total memory bandwidth of up to 3.3 terabytes-per-second (TB/s) per single stack. US technology giant Nvidia Corp. is widely anticipated to be a primary customer for these new chips. The company is offering HBM4 chips in capacities ranging from 24GB to 36GB and has plans to produce 16-layer HBM4 chips with capacities of up to 48GB.

Official Position / Company Statement

Samsung Electronics described its HBM4 memory chips as an "industry-leading" advancement. The company aims to dominate the HBM4 market, following previous quarters where it lagged behind competitors in earlier HBM versions. Hwang Sang-joon, Vice President of Memory Development at Samsung Electronics, stated that Samsung's HBM4 "moves beyond the precedent of relying on existing proven processes by incorporating cutting-edge technologies such as 1c DRAM and foundry 4nm."

Expert / Market Reaction

This development occurs amid rapid growth in the global AI chip market, which is compelling High-Bandwidth Memory (HBM) suppliers to accelerate both production and innovation. The HBM market is projected to exceed USD 10 billion by 2030, with a Compound Annual Growth Rate (CAGR) of approximately 28% from 2023 to 2030, driven by increasing AI workloads. Samsung competes in this market primarily with SK Hynix and Micron Technology; SK Hynix has also announced the development of its own HBM4 products.

Timeline / What's Next

Samsung anticipates its HBM sales to more than triple in 2026 compared to 2025 and is proactively expanding its HBM4 production capacity. The company also plans to introduce HBM4E chips, an upgraded sample product, in the second half of 2026, with custom HBM samples expected to reach customers in 2027. This accelerated production and continued innovation are critical to meet the surging demand from AI data centres globally.

Context / Background

High Bandwidth Memory (HBM) is a type of computer memory specifically engineered to deliver significantly higher data transfer speeds and performance compared to traditional DRAM (Dynamic Random-Access Memory) technologies. HBM achieves this by vertically stacking multiple memory layers and connecting them using through-silicon vias (TSVs), a method that reduces the physical distance data must travel, enabling faster communication between memory and the processor. This advanced memory solution is critical for artificial intelligence (AI) and machine learning applications, which require processing vast volumes of data at high speeds for both model training and inference. HBM plays a vital role in mitigating memory bottlenecks, enhancing GPU (Graphics Processing Unit) utilization, and improving power efficiency within AI data centres. The importance of HBM is further highlighted by the concept of the "AI memory wall," which refers to the growing disparity between processor speed and memory bandwidth, a bottleneck that HBM aims to resolve.

Key Takeaways

• Samsung Electronics has commenced mass production and shipment of its next-generation HBM4 memory chips.
• These HBM4 chips are crucial for powering the expanding demands of artificial intelligence (AI) data centres due to their high bandwidth and efficiency.
• US technology giant Nvidia Corp. is expected to be a primary customer, highlighting the chips' significance for leading AI hardware.
• Samsung aims to significantly increase its HBM sales in 2026 and plans further advancements with HBM4E and custom HBM products.

People Also Ask

1. What are HBM4 memory chips?
HBM4, or High Bandwidth Memory 4, represents the sixth generation of stacked memory technology designed to offer significantly higher data transfer speeds and performance than conventional DRAM. It is crucial for high-performance computing and AI applications.

2. Why is high-bandwidth memory essential for AI?
High-bandwidth memory (HBM) is essential for AI because it enables faster data processing, reduces memory bottlenecks, and improves power efficiency. AI models require rapid access to vast datasets for training and inference, tasks at which HBM excels by providing superior data transfer rates.

3. Which companies are leading in HBM production?
The HBM market is dominated by three global manufacturers: SK Hynix, Samsung Electronics, and Micron Technology. Samsung has announced itself as the first to mass-produce HBM4, while SK Hynix has also announced its development.

4. How do HBM4 chips improve AI data centre performance?
HBM4 chips enhance AI data centre performance by providing significantly higher bandwidth (up to 3.3 TB/s per stack for Samsung's HBM4) and lower latency. This allows AI accelerators and GPUs to process large amounts of data more quickly and efficiently, preventing bottlenecks and accelerating AI model training and inference.

Last updated: February 13, 2026